Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12151904
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Filing Dt:
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05/08/2008
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Publication #:
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Pub Dt:
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11/13/2008
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Inventors:
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Kuo-Ching Tsai, Chang-Fu Lin
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Title:
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Flip-chip semiconductor package and package substrate applicable thereto
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG RD., TANTZU |
| TAICHUNG, TAIWAN ROC |
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| PETER F. CORLESS |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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