Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12175753
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Filing Dt:
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07/18/2008
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Publication #:
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Pub Dt:
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11/20/2008
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Inventors:
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Siew S. Hiew, Abraham C. Ma, Nan Nan, Jin Kyu Kim
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Title:
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DIRECT PACKAGE MOLD PROCESS FOR SINGLE CHIP SD FLASH CARDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2079 NORTH CAPITOL AVENUE |
| SAN JOSE, CALIFORNIA 95132 |
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| BEVER, HOFFMAN & HARMS, LLP |
| 2099 GATEWAY PLACE, SUITE 320 |
| SAN JOSE, CA 95110 |
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