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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10581165
Filing Dt:
05/31/2006
Publication #:
20080287573
Pub Dt:
11/20/2008
Inventors:
Hee-Woo Rhee, Do Young Yoon, Kook Heon Char, Jin-Kyu Lee, Bongjin Moon, Sung-Kyu Min et al
Title:
Ultra-Low Dielectrics Film for Copper Interconnect
Assignment: 1
Reel/Frame:
017980/0247Recorded: 05/31/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
RHEE, HEE-WOO
Exec Dt:
04/27/2006
YOON, DO YOUNG
Exec Dt:
04/27/2006
CHAR, KOOK HEON
Exec Dt:
04/27/2006
LEE, JIN-KYU
Exec Dt:
04/27/2006
MOON, BONGJIN
Exec Dt:
04/27/2006
MIN, SUNG-KYU
Exec Dt:
04/27/2006
PARK, SE-JUNG
Exec Dt:
04/27/2006
SHIN, JAE-JIN
Exec Dt:
04/27/2006
Assignee:
INDUSTRY-UNIVERSITY COOPERATION FOUNDATION SOGANG UNIVERSITY
1 SINSU-DONG, MAPO-GU
SEOUL, KOREA, REPUBLIC OF 121-742
Correspondent:
RONALD R. SANTUCCI
FROMMER LAWRENCE & HAUG LLP
745 FIFTH AVENUE
NEW YORK, NY 10151

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