Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11722847
|
Filing Dt:
|
06/26/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/27/2008
| | | | |
|
Inventors:
|
Tomoya Hidaka, Norifumi Nakamoto, Yoshitaka Fujita
|
|
Title:
|
Forming Mold Or Electroforming Mother Die Having Release Layer And Method For Manufacturing The Same
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
|
|
|
|
| JOSEPH R. ROBINSON |
| P.O. BOX 770, CHURCH STREET STATION |
| NEW YORK, NY 10008-0770 |
|
|
Search Results as of:
04/27/2024 02:10 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
