Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/15/2011
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Application #:
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11828741
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Filing Dt:
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07/26/2007
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Publication #:
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Pub Dt:
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11/27/2008
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Inventor:
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Yun Mook PARK
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Title:
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WAFER LEVEL SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN |
CHUNGBUK, KOREA, REPUBLIC OF 363-883 |
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HOSOON LEE |
210 SW MORRISON STREET |
SUITE 400 |
PORTLAND, OR 97204 |
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