Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/08/2010
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Application #:
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11817761
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Filing Dt:
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08/07/2008
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Publication #:
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Pub Dt:
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11/27/2008
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Inventor:
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Byoung Su Lee
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Title:
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METHOD OF BONDING ALUMINUM ELECTRODES OF TWO SEMICONDUCTOR SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F, YEWON BLDG, 75-1, YANGJAE-DONG, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| CANTOR COLBURN |
| 55 GRIFFIN ROAD SOUTH |
| BLOOMFIELD, CT 06002 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| IP&T GROUP LLP |
| 8230 LEESBURG PIKE SUITE 650 |
| VIENNA, VA 22182 |
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