Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12036636
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Filing Dt:
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02/25/2008
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Publication #:
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Pub Dt:
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01/01/2009
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Inventors:
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Chun-fu FANG, Ming-Hung Su, Yu-Ren Chen
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Title:
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Multi-chips Stacked package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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CANON'S COURT, 22 VICTORIA STREET |
HAMILTON, BERMUDA HM 12 |
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SINORICA, LLC |
528 FALLSGROVE DRIVE |
ROCKVILLE, MD 20850 |
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