Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12232019
|
Filing Dt:
|
09/10/2008
|
Publication #:
|
|
Pub Dt:
|
01/08/2009
| | | | |
Inventors:
|
Cheng-Ta Ko, Su Tsai Lu
|
Title:
|
A THREE-DIMENSIONAL CHIP-STACK PACKAGE WITH A COMPONENT- EMBEDDED
PLATE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 195, SEC. 4, CHUNG HSING RD. |
CHUTUNG HSINCHU, TAIWAN R.O.C. 31040 |
|
|
|
HARNESS, DICKEY & PIERCE, P.L.C. |
P.O. BOX 8910 |
RESTON, VA 20195 |
|
|
Search Results as of:
05/13/2024 05:04 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|