Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/19/2011
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Application #:
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12281599
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Filing Dt:
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09/03/2008
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Publication #:
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Pub Dt:
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01/08/2009
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Inventor:
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Takayuki Kaneko
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Title:
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WAFER MACHINING METHOD FOR PREPARING A WAFER FOR DICING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIMORENJAKU 9-CHOME |
| MITAKA-SHI, TOKYO, JAPAN 1818515 |
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| DAVID S. SAFRAN |
| PO BOX 10064 |
| MCLEAN, VA 22102 |
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Assignment:
2
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CHANGE OF ADDRESS OF ASSIGNEE
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| 2968-2, ISHIKAWA-MACHI |
| HACHIOJI-SHI, TOKYO, JAPAN 192-0032 |
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| DAVID S. SAFRAN |
| PO BOX 10064 |
| MCLEAN, VA 22102 |
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