Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12076428
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Filing Dt:
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03/18/2008
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Publication #:
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Pub Dt:
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01/15/2009
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Inventors:
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Eung-Suek Lee, Je-Gwang Yoo, Chang-Sup Ryu, Jun-Oh Hwang, Jee-Soo Mok
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Title:
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Heat-releasing printed circuit board and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| STAAS & HALSEY LLP |
| ATTENTION: DAVID M. PITCHER |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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