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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/09/2012
Application #:
12131821
Filing Dt:
06/02/2008
Publication #:
Pub Dt:
01/22/2009
Inventors:
Rajit Chandra, John Yanjiang Shu, Adi Srinivasan, Paolo Carnevali
Title:
THERMAL SIMULATION USING ADAPTIVE 3D AND HIERARCHICAL GRID MECHANISMS
Assignment: 1
Reel/Frame:
021238/0463Recorded: 07/15/2008Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/17/2008
Exec Dt:
06/17/2008
Exec Dt:
06/17/2008
Exec Dt:
06/20/2008
Assignee:
4633 OLD IRONSIDES DRIVE, SUITE 200
SANTA CLARA, CALIFORNIA 95054
Correspondent:
WALSTEIN BENNETT SMITH III
P.O. BOX 1668
GEORGETOWN, TX 78627

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