Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12178091
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Filing Dt:
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07/23/2008
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Publication #:
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Pub Dt:
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02/05/2009
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Inventors:
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Sung Kun Park, Kun Hyuk Lee
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Title:
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Test Wafer, Manufacturing Method Thereof and Method for Measuring Plasma Damage
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1000 FORMAN ROAD |
LOWELL, MICHIGAN 49331 |
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JOHN A. WATERS |
FLYNN THIEL BOUTELL & TANIS, P.C. |
305B WATERS BUILDING |
161 OTTAWA AVE., N.W. |
GRAND RAPIDS, MI 49503 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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891-10 DAECHI-DONG, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF 135-280 |
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JEFF LLOYD |
P.O. BOX 142950 |
GAINESVILLE, FL 32614-2950 |
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