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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12178091
Filing Dt:
07/23/2008
Publication #:
Pub Dt:
02/05/2009
Inventors:
Sung Kun Park, Kun Hyuk Lee
Title:
Test Wafer, Manufacturing Method Thereof and Method for Measuring Plasma Damage
Assignment: 1
Reel/Frame:
021385/0801Recorded: 08/13/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/07/2008
Assignee:
1000 FORMAN ROAD
LOWELL, MICHIGAN 49331
Correspondent:
JOHN A. WATERS
FLYNN THIEL BOUTELL & TANIS, P.C.
305B WATERS BUILDING
161 OTTAWA AVE., N.W.
GRAND RAPIDS, MI 49503
Assignment: 2
Reel/Frame:
021279/0930Recorded: 07/23/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/17/2008
Exec Dt:
07/17/2008
Assignee:
891-10 DAECHI-DONG, GANGNAM-GU
SEOUL, KOREA, REPUBLIC OF 135-280
Correspondent:
JEFF LLOYD
P.O. BOX 142950
GAINESVILLE, FL 32614-2950

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