Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11832466
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Filing Dt:
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08/01/2007
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Publication #:
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Pub Dt:
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02/05/2009
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Inventors:
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Shih-Ping Hsu, Chung-Cheng Lien, Shang-Wei Chen, Kan-Jung Chia
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Title:
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PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LI-HSIN RD., |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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LOWE HAUPTMAN HAM & BERNER, LLP |
1700 DIAGONAL ROAD |
SUITE 300 |
ALEXANDRIA, VA 22314 |
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