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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/09/2010
Application #:
12051896
Filing Dt:
03/20/2008
Publication #:
Pub Dt:
02/12/2009
Inventor:
Wei-Min Hsiao
Title:
SAWING METHOD FOR A SEMICONDUCTOR ELEMENT WITH A MICROELECTROMECHANICAL SYSTEM
Assignment: 1
Reel/Frame:
020695/0559Recorded: 03/20/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/11/2008
Assignee:
26 CHIN 3RD RD.,
NANTZE EXPORT PROCESSIN ZONE
KAOHSIUNG, TAIWAN R.O.C.
Correspondent:
ANDREW J. TELESZ, JR
VOLENTINE & WHITE, P.L.L.C.
11951 FREEDOM DRIVE, SUITE 1260
RESTON, VA 20190

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