Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/25/2009
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Application #:
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12197077
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Filing Dt:
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08/22/2008
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Publication #:
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Pub Dt:
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02/26/2009
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Inventor:
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Kan-Jung Chia
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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ALBERT L. SCHMEISER |
18 E. UNIVERSITY DRIVE |
SUITE 101 |
MESA, AZ 85201 |
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