Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12204029
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Filing Dt:
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09/04/2008
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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Ji-Sun Hong, Seung-Kon Mok, Tae-Hun Kim
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Title:
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APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416 MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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STANZIONE & KIM, LLP |
919 18TH STREET, N.W. |
SUITE 440 |
WASHINGTON, DC 20006 |
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