Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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11897971
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Filing Dt:
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08/30/2007
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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Viraj Patwardhan, Hau Nguyen
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Title:
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HIGH STRENGTH SOLDER JOINT FORMATION METHOD FOR WAFER LEVEL PACKAGES AND FLIP APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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BEYER LAW GROUP LLP |
P.O. BOX 1687 |
CUPERTINO, CA 95015-1687 |
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