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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11849724
Filing Dt:
09/04/2007
Publication #:
Pub Dt:
03/05/2009
Inventors:
Zhihong Wang, Alain Duboust, Wei-Yung Hsu, Yan Wang
Title:
ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE
Assignment: 1
Reel/Frame:
020274/0132Recorded: 12/19/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/11/2007
Exec Dt:
09/11/2007
Exec Dt:
09/11/2007
Exec Dt:
09/12/2007
Assignee:
P. O. BOX 450A
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS
P.O. BOX 450A
SANTA CLARA, CA 95052

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