Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12076966
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Filing Dt:
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03/26/2008
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Publication #:
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Pub Dt:
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03/12/2009
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Inventors:
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Chung-Er Huang, Shih-Meng Luo, Sheng-Wen Chen
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Title:
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Conductive metal structure applied to a module IC and method of manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, NO. 94, BAOZHONG RD. |
| XINDIAN |
| TAIPEI, TAIWAN R.O.C. |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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