Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12122779
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Filing Dt:
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05/19/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Inventors:
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Geng-Shin SHEN, Yu-Ren Chen
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Title:
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Multi-Chip Stacked Package Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1. R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| SINORICA, LLC |
| 528 FALLSGROVE DRIVE |
| ROCKVILLE, MD 20850 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNORS AND ASSIGNEES PREVIOUSLY RECORDED ON REEL 020964 FRAME 0135. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNORS: SHEN, GENG-SHIN, CHEN, YU-REN ASSIGNEES: CHIPMOS TECHNOLOGIES INC., CHIPMOS TECHNOLOGIES (BERMUDA) LTD..
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| NO. 1, R&D RD 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM 12, BERMUDA |
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| SINORICA, LLC |
| 528 FALLSGROVE DR. |
| ROCKVILLE, MD 20850 |
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