Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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12274582
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Filing Dt:
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11/20/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Inventor:
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Tsuyoshi Hasegawa
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Title:
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SEMICONDUCTOR PACKAGE WITH PACKAGE MAIN BODY COOLING STRUCTURE USING COOLANT, AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH THE SEMICONDUCTOR PACKAGE AND COOLANT CIRCULATING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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