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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7616448
Issue Dt:
11/10/2009
Application #:
11901042
Filing Dt:
09/14/2007
Publication #:
20090073663
Pub Dt:
03/19/2009
Inventors:
Thomas A. Degenkolb, Scott D. Brandenburg, Larry M. Mandel, Kin Yean Chow et al
Title:
WRAP-AROUND OVERMOLD FOR ELECTRONIC ASSEMBLY
Assignment: 1
Reel/Frame:
019884/0846Recorded: 09/14/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DEGENKOLB, THOMAS A.
Exec Dt:
08/30/2007
BRANDENBURG, SCOTT D.
Exec Dt:
08/30/2007
MANDEL, LARRY M.
Exec Dt:
08/30/2007
CHOW, KIN YEAN
Exec Dt:
08/31/2007
FANG, CHING MENG
Exec Dt:
08/31/2007
YONG, SIM SING
Exec Dt:
08/31/2007
Assignee:
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF - MAIL CODE: 480-410-202
P.O. BOX 5052
TROY, MICHIGAN
Correspondent:
DELPHI TECHNOLOGIES, INC.
M/C 480-410-202
PO BOX 5052
TROY, MI 48007
Assignment: 2
Reel/Frame:
045113/0958Recorded: 01/23/2018Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
DELPHI TECHNOLOGIES, INC
Exec Dt:
11/29/2017
Assignee:
DELPHI TECHNOLOGIES IP LIMITED
ERIN COURT, BISHOP'S COURT HILL
ST. MICHAEL, BARBADOS
Correspondent:
DELPHI TECHNOLOGIES IP LIMITED
5825 INNOVATION DRIVE
LEGAL STAFF - M/C 480-415-154
TROY, MI 48098

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