Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11991489
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Filing Dt:
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12/30/2008
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Publication #:
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Pub Dt:
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05/07/2009
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Inventors:
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Volker Harle, Christoph Eichler
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Title:
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Method for Laterally Cutting Through a Semiconductor Wafer and Optoelectronic Component
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEIBNIZSTRASSE 4 |
| REGENSBURG, GERMANY 930355 |
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| COHEN, PONTANI, LIEBERMAN & PAVANE LLP |
| 551 FIFTH AVENUE |
| SUITE 1210 |
| NEW YORK, NY 10176 |
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