Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12073392
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Filing Dt:
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03/05/2008
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Publication #:
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Pub Dt:
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05/14/2009
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Inventors:
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Lung-Tai Chen, Chun-Hsun Chu, Tzong-Che Ho, Bor-Chen Tsai
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Title:
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Wafer level sensing package and manufacturing process thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN ROC 31040 |
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| STEVEN M. RABIN |
| RABIN & BERDO, PC |
| 1101 14TH ST., NW |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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