Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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12264823
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Filing Dt:
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11/04/2008
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Publication #:
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Pub Dt:
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05/21/2009
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Inventor:
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Keun-hyuk Lee
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Title:
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SEMICONDUCTOR POWER MODULE PACKAGES WITH SIMPLIFIED STRUCTURE AND METHODS OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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82-3 DODANG-DONG, WONMI-GU |
BUCHEON CITY, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 420-711 |
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TOWNSEND AND TOWNSEND AND CREW LLP |
TWO EMBARCADERO CENTER |
EIGHTH FLOOR |
SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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60 WALL STREET |
NEW YORK, NEW YORK 10005 |
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DANIEL GOLD/WHITE & CASE LLP |
1221 AVENUE OF THE AMERICAS |
NEW YORK, NY 10020 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, ARIZONA 85008 |
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, AZ 85008 |
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Assignment:
4
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RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 04481, FRAME 0541
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5005 EAST MCDOWELL ROAD, MAILDROP A700 |
PHOENIX, ARIZONA 85008 |
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5005 EAST MCDOWELL ROAD, MAILDROP A700 |
PHOENIX, ARIZONA 85008 |
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JUSTINE LU/WHITE & CASE LLP |
555 SOUTH FLOWER STREET, SUITE 2700 |
LOS ANGELES, CA 90071 |
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