Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11992594
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Filing Dt:
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07/03/2008
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Publication #:
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Pub Dt:
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05/21/2009
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Inventors:
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Eiichi Tamiya, Yoshiyuki Yokoyama, Satoshi Fujiki, Katsumi Tanino, Atsushi Muraguchi et al
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Title:
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Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7, SHINSOGAWA |
| TOYAMA-SHI, TOYAMA 9308501, JAPAN |
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| 7-1, KANDA-NISHINI-CHO 3-CHOME |
| CHIYODA-KU, TOKYO 101-0054, JAPAN |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VIRGINIA 22320-4850 |
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