Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12318386
|
Filing Dt:
|
12/29/2008
|
|
Publication #:
|
|
Pub Dt:
|
05/21/2009
| | | | |
|
Inventors:
|
Sang-Wook Park, Joong-Hyun Baek, Hae-Hyung Lee, Jin-Yang Lee, Hee-Kook Choi
|
|
Title:
|
Memory module, socket and mounting method providing improved heat dissipating characteristics
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
|
|
|
|
| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 USA |
|
|
Search Results as of:
06/25/2025 01:56 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
