Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/12/2013
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Application #:
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12059141
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Filing Dt:
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03/31/2008
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Publication #:
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Pub Dt:
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06/04/2009
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Inventor:
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Myung Geun PARK
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Title:
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SUBSTRATE FOR SEMICONDUCTOR PACKAGE WITH IMPROVED BUMPING OF CHIP BUMPS AND CONTACT PADS AND SEMICONDUCTOR PACKAGE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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