Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/25/2012
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Application #:
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12043962
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Filing Dt:
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03/07/2008
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Publication #:
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Pub Dt:
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06/11/2009
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Inventors:
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Jen-Chun Chen, Wu-der Yang
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Title:
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STACKED-TYPE CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK 669,FUHSING 3 RD. KUEISHAN |
| TAOYUAN, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY |
| 7F.-1, NO.100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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