Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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11958288
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Filing Dt:
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12/17/2007
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Publication #:
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Pub Dt:
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06/18/2009
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Inventors:
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You Chye HOW, Shee Min YEONG
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Title:
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METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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BEYER WEAVER LLP |
P.O. BOX 70250 |
OAKLAND, CA 94612-0250 |
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