Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/01/2009
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Application #:
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11955316
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Filing Dt:
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12/12/2007
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Publication #:
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Pub Dt:
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06/18/2009
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Inventors:
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WU-JIANG MA, MIN LI
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Title:
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HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 2, 2ND DONGHUAN ROAD,LONGHUA TOWN, BAO' AN DISTRICT |
SHENZHEN CITY, GUANGDONG PROVINCE, CHINA |
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3-2,CHUNG SHAN ROAD |
TU-CHENG,TAIPEI HSIEN, TAIWAN |
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JEFFREY KNAPP |
458 E. LAMBERT ROAD |
FULLERTON, CA 92835 |
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