Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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12172900
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Filing Dt:
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07/14/2008
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Publication #:
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Pub Dt:
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06/25/2009
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Inventors:
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Tzong-Che Ho, Jason Pan, Pin Chang, Chin-Horng Wang, Jung-Tai Chen, Hsin-Li Lee et al
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Title:
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ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 CHUNG HSING ROAD, SEC. 4, CHUTUNG |
| HSINCHU, TAIWAN |
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| QUINTERO LAW OFFICE |
| 2210 MAIN STREET, SUITE 200 |
| SANTA MONICA, CA 90405 |
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