Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12010571
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Filing Dt:
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01/28/2008
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Publication #:
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Pub Dt:
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07/30/2009
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Inventors:
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Fu-Chung Wu, Sheng-Yuan Tsai
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Title:
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Bonding pad structure and debug method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 66,. HOU-KANG ST., |
| SHIH-LIN DISTRICT |
| TAIPEI CITY 111, TAIWAN ROC |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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