Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12117026
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Filing Dt:
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05/08/2008
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Publication #:
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Pub Dt:
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08/06/2009
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Inventors:
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Yu-Jean Chen, Brian C. Auman, Sheng-Yu Huang, Tsutomu Mutoh, Yu-Chih Yeh, Ming-Te We
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Title:
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HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4417 LANCASTER PIKE |
| LEGAL-PATENTS |
| WILMINGTON, DELAWARE 19805 |
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| KONRAD S. KAEDING |
| 4417 LANCASTER PIKE |
| LEGAL-PATENTS |
| WILMINGTON, DE 19805 |
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