Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/24/2012
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Application #:
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12285027
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Filing Dt:
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09/29/2008
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Publication #:
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Pub Dt:
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08/27/2009
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Inventors:
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Bily Wang, Shih-Yu Wu, Wen-Kuei Wu
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Title:
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LED CHIP PACKAGE STRUCTURE WITH MULTIFUNCTIONAL INTEGRATED CHIPS AND A METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18, LANE 522, SEC. 5 |
| JHONGHUA RD. |
| HSINCHU CITY, TAIWAN R.O.C. |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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