Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12037471
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Filing Dt:
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02/26/2008
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Publication #:
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Pub Dt:
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08/27/2009
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Inventors:
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Yong Liu, Zhongfa Yuan, Erwin lan Almagro
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Title:
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STACKED DIE MOLDED LEADLESS PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 82 RUNNING HILL ROAD |
| SOUTH PORTLAND, MAINE 04106 |
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| THOMAS R. FITZGERALD, ESQ. |
| HISCOCK & BARCLAY, LLP |
| 2000 HSBC PLAZA, 100 CHESTNUT ST. |
| ROCHESTER, NY 14604-2404 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL ROAD, MD A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
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