Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12182180
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Filing Dt:
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07/30/2008
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Publication #:
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Pub Dt:
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08/27/2009
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Inventors:
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Hyuck Mo LEE, Dong Hoon KIM, Moon Gi CHO
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Title:
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JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 373-1, GUSUNG-DONG, YUSEONG-KU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
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| GEORGE S. BARDMESSER |
| 910 17TH STREET, N.W., SUITE 800 |
| WASHINGTON, DC 20006 |
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