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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7905011
Issue Dt:
03/15/2011
Application #:
12280907
Filing Dt:
08/27/2008
Publication #:
20090229120
Pub Dt:
09/17/2009
Inventors:
Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Takashi Kitae, Susumu Matsuoka et al
Title:
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
Assignment: 1
Reel/Frame:
021577/0045Recorded: 09/24/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TANIGUCHI, YASUSHI
Exec Dt:
07/23/2008
NAKATANI, SEIICHI
Exec Dt:
07/24/2008
KARASHIMA, SEIJI
Exec Dt:
07/16/2008
KITAE, TAKASHI
Exec Dt:
07/16/2008
MATSUOKA, SUSUMU
Exec Dt:
07/16/2008
KOYAMA, MASAYOSHI
Exec Dt:
07/16/2008
Assignee:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
KENJI KAMATA
1130 CONNECTICUT AVE., N.W., SUITE 1100
PANASONIC PATENT CENTER
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
022363/0306Recorded: 03/06/2009Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Exec Dt:
10/01/2008
Assignee:
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
KENJI KAMATA
1130 CONNECTICUT AVE., N.W., SUITE 1100
PANASONIC PATENT CENTER
WASHINGTON, DC 20036

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