Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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12102701
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Filing Dt:
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04/14/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Inventors:
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Je Il RYU, You Sung KIM
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Title:
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MULTI-CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SAN 136-1, AMI-RI, BUBAL-EUB, KYOUNGKI-DO |
ICHEON-SI, KOREA, REPUBLIC OF |
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STEVE Y. CHO |
TOWNSEND AND TOWNSEND AND CREW LLP |
TWO EMBARCADERO CENTER, 8TH FLOOR |
SAN FRANCISCO, CA 94111-3834 |
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