Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/20/2010
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Application #:
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12325303
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Filing Dt:
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12/01/2008
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Publication #:
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Pub Dt:
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09/24/2009
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Inventors:
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Geng-Shin SHEN, Yu-Ren Chen
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Title:
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CHIP PACKAGE STRUCTURE AND THE METHOD THEREOF WITH ADHERING THE CHIPS TO A FRAME AND FORMING UBM LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1. R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM12, BERMUDA |
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| SINORICA, LLC |
| 528 FALLSGROVE DRIVE |
| ROCKVILLE, MD 20850 |
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