Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12150529
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Filing Dt:
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04/28/2008
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Publication #:
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Pub Dt:
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10/29/2009
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Inventors:
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Dorota Temple, Robert O. Conn
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Title:
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Through-substrate power-conducting via with embedded capacitance
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3040 CORNWALLIS ROAD |
| RESEARCH TRIANGLE PARK, NORTH CAROLINA 27709 |
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| IMPERIUM PATENT WORKS |
| T. LESTER WALLACE |
| P.O. BOX 587 |
| SUNOL, CA 94586 |
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