Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12485059
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Filing Dt:
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06/16/2009
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Publication #:
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Pub Dt:
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11/05/2009
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Inventors:
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Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien
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Title:
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CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 566, KAO-SHI RD., YANG-MEI |
| TAOYUAN HSIEN, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F., NO. 566, KAO-SHAN LI, KAOSHI RD., YANG-MEI CITY |
| TAOYUAN COUNTY, TAIWAN 326 |
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| YING CHEN CHEN YOSHIMURA LLP |
| 108 W 2ND STREET |
| #514 |
| LOS ANGELES, CA 90012 |
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