Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/20/2011
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Application #:
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12222093
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Filing Dt:
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08/01/2008
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Publication #:
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Pub Dt:
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11/05/2009
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Inventor:
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Chi-Hsing Hsu
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Title:
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IMAGE-SENSING CHIP PACKAGE MODULE FOR REDUCING ITS WHOLE THICKNESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, NO, 94, BAOZHONG RD. XINDIAN |
| TAIPEI, TAIWAN R.O.C. |
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| MORTON J. ROSENBERG, ESQ. |
| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT DRIVE, SUITE 101 |
| ELLICOTT CITY, MARYLAND 21043 |
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