Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/24/2012
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Application #:
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12505593
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Filing Dt:
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07/20/2009
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Publication #:
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Pub Dt:
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11/12/2009
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Inventor:
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Tetsuro Nishimura
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Title:
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METHOD OF COPPER PRECIPITATION IN LEAD-FREE SOLDER, GRANULATION AND SEPARATION OF (CUX)6SN5 COMPOUNDS AND RECOVERY OF TIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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16-15, ESAKACHO 1-CHOME |
SUITA-SHI |
OSAKA, JAPAN 564-0063 |
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JOHN F. KANE |
P.O. BOX 8801 |
2000 COURTHOUSE PLAZA NE |
DAY, OH 45401-8801 |
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