Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2011
|
Application #:
|
12175094
|
Filing Dt:
|
07/17/2008
|
|
Publication #:
|
|
Pub Dt:
|
11/19/2009
| | | | |
|
Inventors:
|
Meng-Han Lee, Wei-Wen Lan, Shi-Shyan James Shang, Ching-Ming Chuang
|
|
Title:
|
HIGH DENSITY PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 338, SEC. 1, NANKAN RD. |
| JING HSIN VILLAGE, LUCHU HSIANG |
| TAOYUAN COUNTY, TAIWAN |
|
|
|
|
| QUINTERO LAW OFFICE |
| 2210 MAIN STREET |
| SUITE 200 |
| SANTA MONICA, CA 90405 |
|
|
Search Results as of:
05/30/2024 10:50 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
