Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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12095668
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Filing Dt:
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06/09/2008
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Publication #:
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Pub Dt:
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11/19/2009
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Inventor:
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Yun Mook Park
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Title:
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BUMP WITH MULTIPLE VIAS FOR SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF, AND SEMICONDUCTOR PACKAGE UTILIZING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN |
| CHUNGBUK, KOREA, REPUBLIC OF 363-883 |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| 210 SW MORRISON STREET, SUITE 400 |
| PORTLAND, OR 97204 |
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