Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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11995868
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Filing Dt:
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01/16/2008
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Publication #:
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Pub Dt:
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11/26/2009
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Inventor:
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Tetsuro Nishimura
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Title:
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A REPLENISHED LEAD-FREE SOLDER AND A CONTROL METHOD FOR COPPER DENSITY AND NICKEL DENSITY IN A SOLDER DIPPING BATH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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16-15, ESAKACHO 1-CHOME |
SUITA-SHI, OSAKA, JAPAN 564-0063 |
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JOHN F. KANE |
P.O. BOX 8801 |
DAYTON, OH 45401-8801 |
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