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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12293423
Filing Dt:
09/17/2008
Publication #:
Pub Dt:
11/26/2009
Inventor:
Byoung Jae Park
Title:
PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
021595/0778Recorded: 09/17/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/04/2008
Assignee:
#304 GJTP VENTURE ENTERPRISE CENTER
958-3, DAECHON-DONG, BUK-GU
GWANGJU, KOREA, REPUBLIC OF 500-706
Correspondent:
MITCHELL P. BROOK
11988 EL CAMINO REAL, SUITE 200
SAN DIEGO, CALIFORNIA 92130
Assignment: 2
Reel/Frame:
024260/0591Recorded: 04/20/2010Pages: 2
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/30/2009
Assignee:
5F, ACE TECHNO TOWER, 55-7, MULLAE-DONG 3-GA, YEONGDEUNGPO-GU
SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Correspondent:
JASON BERRY
600 WEST BROADWAY, SUITE 2600
SAN DIEGO, CA 92101

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