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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/17/2011
Application #:
12387293
Filing Dt:
04/30/2009
Publication #:
Pub Dt:
11/26/2009
Inventors:
Chi-Tsung Chiu, Pao-Nan Lee
Title:
SEMICONDUCTOR PACKAGE HAVING AN ANTENNA ON THE MOLDING COMPOUND THEREOF
Assignment: 1
Reel/Frame:
022704/0462Recorded: 05/19/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/27/2009
Exec Dt:
04/27/2009
Assignee:
26 CHIN 3RD RD.
NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondent:
MCCRACKEN & FRANK LLP
311 S. WACKER DRIVE
SUITE 2500
CHICAGO, IL 60606

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