Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12240362
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Filing Dt:
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09/29/2008
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Publication #:
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Pub Dt:
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12/03/2009
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Inventor:
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Chin-Ti Chen
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Title:
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Lead Frame and Chip Package Structure and Method for Fabricating the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26 DATONG RD HSINCHU INDUSTRIAL PARK |
| HUKOU |
| HSINCHU, TAIWAN |
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| WILLIAM J. COOPER |
| ESCHWEILER & ASSOCIATES LLC |
| 629 EUCLID AVENUE, SUITE 1210 |
| CLEVELAND, OHIO 44114 |
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